2.4/5GHz WiFi 6 high-performance dual-band wireless, onboard throughput 1Gbps, supports MU-MIMO and OFDMA, high bandwidth and large capacity
Yuneng Micro's WIFI6 high-performance dual-band wireless onboard module features a Qualcomm high-performance chip, supporting 2.4G/5G dual-band connectivity with an effective throughput of 1GBps and a connection rate of 1.2G. It is compatible with multiple WIFI protocols and supports proprietary technologies such as MU-MIMO and OFDMA, with adjustable bandwidth from 20-160MHz. The module has a transmit power of 23dBm and a maximum receive sensitivity of -96dBm. It can connect up to 128 nodes in base station mode and up to 512 nodes in client mode, adapting to various network topologies such as MESH. With an industrial-grade design, it operates in a temperature range of -40℃ to +65℃, weighs only 85g, and is equipped with a variety of interfaces including fiber optic and Ethernet ports, operating on a low-power 24V supply. It can be used as a CPE embedded module, widely applied in industrial AI vision feedback, inspection robots, unmanned factories, and other scenarios. It is also suitable for wireless networking in commercial, office, and scenic areas, supporting complete unit, bare board supply, and customized services.
Key Features
- Hotels / guesthouses / cafés / restaurants / retail chains / shopping malls / supermarkets
- Enterprises / offices / meeting rooms / healthcare & education / campuses / dormitories / hospitals
- Scenic areas / parks / railway stations / home Wi-Fi / villas / duplex residences
Product Advantages
- Supports 802.11 a/b/g/n/ac/ax Wi-Fi protocols
- Link rate up to 1.2Gbps
- Supports MU-MIMO and OFDMA
- Designed based on intrinsic-safety powered device (PD) specifications
Product Features
- Frequency: 2412-2482MHz; 5180-5850MHz
- Designed based on intrinsic-safety powered device specifications (*intrinsic-safety certification not included; please obtain certification separately if required)
- Supports WAPI AP and client (not supported at present; customization available)
After-Sales Service
- Complete-device solutions available to help customers accelerate time-to-market
- Provides bare-board delivery and integrated solution technical guidance
- End-to-end customization for equipment enclosure, functions, and software
Specifications
Interface Description
Application Scenarios
Networking hardware and interaction logic:
- Using wireless transmission, it builds a communication bridge between two or more networks for data transport, connecting different network segments to achieve trans
mission objectives. Supports point-to-point, relay networking, multi-hop relays, point-to-multipoint networking, and MESH networking topologies
